The test. The last reading. It weakens if advanced packages are bonded outside Taiwan in qualified volume production and the share of the relevant supply made off the island is rising from the end of 2027 to the end of 2028.
a mixed or partial reading As for the reading of 31 December 2027.
From The AI Compute Race. Read the book
- Falls due
- Read on
- Bonding on the packager’s own statement, and the share on the trade press’s estimates
- Chapter
- Chapter 5 — The Island in Every Machine
Why every accelerator runs through Taiwan: the foundry, the packaging and the memory that are booked years ahead, and what that does to anyone arriving late with cash.
Filings that bear on it
- U.S. Department of Commerce, CHIPS Program Office, “Department of Commerce Announces Agreement with GlobalFoundries to Amend Its Existing CHIPS Program Award and Reallocate $955 Million to Accelerate Investments in Silicon Photonics, Silicon-Germanium, and Advanced Packaging,” NIST, 14 October 2026
Commerce’s CHIPS office agreed on 14 October 2026 to reallocate up to $955 million within GlobalFoundries’ existing CHIPS award toward its New York and Vermont plants, including the first U.S.-based source of silicon interposers for advanced packaging.
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How to cite this page
Dryburgh, Lee S. “Chapter 5, the concentration half.” In The AI Compute Race. DRYBURGH. https://dryburgh.com/vol1/tests/2028-8 (accessed 2026-11-01).
BibTeX
@misc{dryburgh-chapter-5-the-concentration-half-2026,
author = {Dryburgh, Lee S.},
title = {{Chapter 5, the concentration half}},
howpublished = {In \emph{The AI Compute Race}, DRYBURGH},
year = {2026},
url = {https://dryburgh.com/vol1/tests/2028-8},
note = {Accessed 2026-11-01}
}